发明名称 |
Integrated circuit device package interconnect means |
摘要 |
An integrated circuit device package is disclosed wherein a pair of dielectric support structures are provided, each one having a pattern of electrical conductors for interconnecting integrated circuit devices disposed thereon. The electrical conductors have end portions terminating into a plurality of contact pads disposed on a first surface of the support structures. A first one of the pair of support structures has corresponding contact pads on a second, opposite surface of the support structure, each one of the contact pads on the first surface being electrically connected to a corresponding one of the contact pads on the second surface. A dielectric spacer having a plurality of electrical contact pins is disposed between the pair of support structures. One end of each pin is electrically connected to a corresponding one of the contact pads disposed on the second surface of the first one of such structures, and the other end of such contact pin is electrically connected to a corresponding one of the contact pins disposed on the first surface of the second one of the structures. The contact pins are relatively short and thereby provide a relatively short electrical interconnect for the integrated circuit devices, thereby reducing parasitic capacitances normally associated with electrical interconnects. |
申请公布号 |
US4225900(A) |
申请公布日期 |
1980.09.30 |
申请号 |
US19780954513 |
申请日期 |
1978.10.25 |
申请人 |
RAYTHEON COMPANY |
发明人 |
CICCIO, JOSEPH A.;THUN, RUDOLF E.;FARDY, HARRY J. |
分类号 |
H05K1/14;(IPC1-7):H05K1/08 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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