| 摘要 |
PURPOSE:To improve the wet condition of the solder during the pellet soldering by forming a Ni film not containing P on the surface of the header alone. CONSTITUTION:The lead hole of the stem header 1 of copper is planted with a lead 3 through a glass and a Ni plated layer containing P is formed by electrolyte-free plating. Then, with the header as positive pole, an electric field Ni plating is performed by rack plating system. At the moment, an Ni film 7 without non-glossy P is formed on the surface of the heater, but none on the surface of the lead. Then, an Si pellet 4 is soldered. In this manner, fastening can be made with a good solderability at a low without use of Ag or the like. The heat reasistance is limited. Finally, connection 6 is made between electrodes of the lead and the pellet. |
