| 摘要 |
<p>PURPOSE:To prevent a semiconductor element from being exfoliated and improve the moisture resistance of the element, by providing a heat radiator plate between a pellet and an insulating plate such that the heat radiator plate is projected beyond the edge of the insulating plate, and sealing the element on the radiator plate with a hard resin. CONSTITUTION:An insulating plate 2 is soldered 3 to a heat radiator plate 1, and a heat radiator plate 9 of copper is bonded to the insulating plate 2. The plate 9 has a larger area than the plate 2 so that the former is extended beyond peripheral portions of the latter to form eaves-like sections. A semiconductor element 5 is set on the plate 9 and connects lead wires 10 which are provided separately from the plate 9. The element 5 is sealed with epoxy resin 11 on the plate 1. According to this structure, the resin 11 is restricted by the plate 9 having the eaves-like sections so that the resin 11 does not come off even when thermal strain occurs therein. Even when water runs into the structure from the interface of the plate 1 and resin 11, it never reaches the element 5. Therefore, this semiconductor device has a high moisture resistance.</p> |
