| 摘要 |
<p>PURPOSE:To provide an image taking element board adapted for a small and light color solid image taking device in high yield by forming a color separating filter directly at a light receiving portion and simultaneously forming a light shielding layer made of insulating material in the region except the light receiving portion. CONSTITUTION:A CCD solid image taking element 1 is formed on a silicon wafer by a normal wafer process such as vapor phase growing, impurity diffusing, photoetching, metal evaporating process or the like, stripe made of casein is formed at predetermined position on the light receiving portion 11, and the casein is also coated on a black index signal pickup portion, a storage portion 12 and a shift register 13. Then, they are dyed as a first coloring layer 17R, treated with resist, dyed as a second coloring layer 17G, treated with resist, and dyed as a third coloring layer 17B, and treated with resist. Thus, color separating filters 17R, 17G, 17B are formed directly on the light receiving portion 11. Insulating light shielding layers 15, 16 are formed on the storage portion 12 and the resistor 13.</p> |
