| 摘要 |
The resistance material of a thick-film resistor is applied to a substrate in a layer having a configuration that tapers in a direction transverse to the direction of flow of current and the conductive leads are provided in contact with the tapering edges of the layer. A small incision on the shorter side of the layer between the tapering edges to which the leads are applied will have a relatively large effect on the resistance value without great effect on the amount of the area that determines the power rating of the resistor, so that trimmming by such an incision can be done quickly and the resistance change with progressive incision is more uniform than in the case of a resistor layer of rectangular configuration. |
