发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the title composition excellent in sensitivity and resolution, crosslinkable without any additive such as a photopolymerization initiator and useful as a heat-resistant photopolymer material for semiconductors, by mixing a specified polyamic acid ester with an azide polymer and, optionally, a sensitizer etc. CONSTITUTION:100pts.wt. polyamic acid ester (A) having repeating units of formula I (wherein R1 is a tetravalent organic group composed of a carboaromatic ring group, a heteroaromatic ring group or the like, R2 is a bivalent organic group containing at least one of said ring groups in the structure, R3 is a group having a -C=C- group crosslinkable with an actinic radiation or the like, and the main chain is ortho or peri to the -COOR3 groups) and having an MW of 1,000-100,000 is mixed with 1-100pts.wt. azide polymer (B) of formula II (wherein R4 is a bivalent organic group containing an aromatic ring group in the structure, and the azide group is directly bonded to the aromatic ring group) and an MW of 100-1,000,000 and, optionally, at most 20pts.wt. photopolymerization initiator, sensitizer, etc.
申请公布号 JPH01172455(A) 申请公布日期 1989.07.07
申请号 JP19870329973 申请日期 1987.12.28
申请人 TOSOH CORP 发明人 YAMAMOTO TAKASHI;KIYOTA TORU;MATSUMURA KOUZABUROU;NAGAOKA KIYOUKO
分类号 C08K5/27;C08L79/08;G03F7/012;G03F7/038 主分类号 C08K5/27
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