发明名称 HEAT CONDUCTIVE SEALER
摘要 PURPOSE:To improve the heat conductivity of the sealer without lower performance and increase in the heat conductive filler by filling the base resin with a metal fiber good in the heat conductivity or a pliable heat conductive fiber. CONSTITUTION:A base resin 2 such as butyl is filled with a properly pliable heat conductive fiber such as aluminum fiber 3. Thus, an extremely higher contact is possible between the heat conductive fibers within the base resin as compared with the conventional powder. The heat conductivity can be improved without increased filler while the pliability of the fiber itself eliminates the diterioration in the tackiness, adhesivity and pliability of the base resin.
申请公布号 JPS55121395(A) 申请公布日期 1980.09.18
申请号 JP19790028980 申请日期 1979.03.13
申请人 发明人
分类号 F28F21/02;F28F13/00;F28F21/08 主分类号 F28F21/02
代理机构 代理人
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