| 摘要 |
<p>In a structure wherein a semiconductor element (12) is brazed onto a metallized layer (13) formed on an insulator substrate with a brazing solder and electrodes of the semiconductor element (12) are connected to the metallized layer (13) through wire leads, the element-brazed portion (13-a) and the leadwire-connected portion (13-b) in the metallized layer (13) are isolated on a plane by an isolation region (41) and sealing member (20), within an opening made in the sealing member (20). </p> |
