Method and apparatus for evaluating electroless plating.

摘要

A test piece is immersed in an electroless plating bath. It is then electrically charged instantaneously via a counter electrode to have a polarization potential n(t) of a few millivolts. The charge consumed by the electroless plating reaction of the test piece is measured by a potential recorder in the form of a variation of the polarization potential n(t) with respect to time t. The n(t)-t relation is analyzed to obtain a resistance R of the test piece. After the potential of the test piece has returns to electroless deposition potential EELP, the test piece is charged again until its polarization potential n(t) rises to 50 millivolts or more. A n(t)-t relation is obtained. Based on the n(t)-t relation, a Tafel slope βa of anodic reaction is obtained. After the potential of the test piece has returned to electroless deposition potential EELP, the test piece is so charged for the third time as to have its polarization potential n(t) lowered to -50 millivolts or less, and a n(t)-t relation is obtained. This relation is analyzed to obtain a Tafel slope βc of anodic reaction of the test piece. Based on the reaction resistance R, Tafel slopes βa and βc, an electroless plating current density IELP is obtained. Based on the electroless plating current density IELP, a rate of electroless plating VELP is calculated.