发明名称 Method of manufacturing a contact bridge
摘要 A method of manufacturing a contact bridge for an electric switching apparatus which contact bridge includes an electrically highly conductive overlay and a concave-shaped support layer. The method comprises the steps of pressing a powder blank comprising two layers of metallic material, one of which comprises iron for the support layer and the other of which comprises copper for the overlay; sintering the blank in a protective gas; sizing the blank; further sintering the blank in a protective gas; further pressing the blank by reverse-flow cup extrusion; and applying an electrical contact to the overlay. Alternatively, the powder blank may comprise a layer of copper-zirconium and silver-metal oxide, the latter for an electrical contact layer. In this embodiment, the contact bridge is formed with the electrical contact in one step and there is no need to apply a contact to the bridge after the pressing by reverse-flow cup extrusion.
申请公布号 US4222167(A) 申请公布日期 1980.09.16
申请号 US19780899961 申请日期 1978.04.25
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HAESSLER, HEINRICH;GROSSE, JOACHIM;FISCHER, GERT;HANNICH, JOACHIM
分类号 B22F3/24;B22F7/00;H01H1/06;H01H11/04;(IPC1-7):H01R43/00 主分类号 B22F3/24
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