| 摘要 |
PURPOSE:To equalize the heat dissipating characteristics of two complementary polar transistors formed in an integrated circuit device by fixing heat dissipating elements to the same plane in such a manner that the back surfaces of the elements are exposed when forming the integrated circuit device using the two transistors. CONSTITUTION:When heat dissipating elements are secured to the back surfaces of complementary polar transistors 2, 4, respectively, two elements 6, 7 of the same shape with the same height are fixed to the back surfaces of the transistors 2, 4, respectively using bonding solder 8 instead of one common heat dissipating element. Then, the surface sides of the transistors 2, 4 are molded with resin 5 so that the back surfaces of the elements 6, 7 are exposed with external atmosphere. Thus, unbalanced heat dissipating characteristics are eliminated between the transistors 2 and 4 to improve the reliability of the transistors. |
