| 摘要 |
PURPOSE:To indicate an improper chip on a semiconductor wafer, having less danger of contaminating the wafer or cracking the wafer by forming improper chip indicating pads made of low hardness metal on the chip. CONSTITUTION:Improper chip indicating pads 5 made of low hardness metal such as aluminum or the like are formed on each of chips on a wafer. The probe of an electric testing device is contacted with the pad to electrically test the wafer. When the chip 20 is improper, the pad 5 is scratched with crack 6 for indicating impropriety with weak force using a scratch mark unit to indicate the impropriety thereon. Since the pad is scratched with weak force, silicon powder is not adhered onto the wafer as compared with the conventional method of indicating the scratch directly on the chip, and there exists no danger of cracking the wafer. Since the scratch is put on predetermined position, it can be automatically sorted. |
