| 摘要 |
PURPOSE:To rationally obtain a desired quality of a semiconductor device by molding a number of printed boards carrying electronic parts by using a transfer molding die burying silicone rubber in the portion for retaining the substrates. CONSTITUTION:A conductor pattern is formed on a printed board 1, and a semiconductor element 2 is carried thereon. The board 1 is set in molds 13, 14. The mold has a cavity 18, and a silicone rubber 10 for preventing flow of resin for retaining the board 1. The resin is flowed from a gate 16 into the cavity 18 to seal the semiconductor element 1 and wires 17 in the cavity 18. At this time the resin flowed from the cavity 18 can be completely retained by the silicone rubber 10. Thus, the transfer molding system is applied to the printed board having ruggedness on the surface to provide a desired quality of product. |
