| 摘要 |
<p>PURPOSE:To reduce the weight of a rectifier by soldering a silicon chip through an iron base to an aluminum cooling piece when assembling the rectifier with the chip. CONSTITUTION:A silicon chip 2 and a lead wire 3 are inserted into a recess mold of an iron base 5 formed in recess shape, and are heated to higher temperature than the melting point of the solder 4 through the solder 4 to connect the lead wire 3 to the chip 2. A surface protecting agent 10 is filled in the base 5 thus connected to protect the junction of the chip 2. Then, aluminum or aluminum plated with copper or cooling piece 1 provided with black paint 11 is secured to the opposite side of the base 5 having no chip 2, that is, raised portion of the base 5 with solder 6 having lower melting point than the solder 4. Since the base 5 for reducing the heat stress is interposed between the chip 2 and the cooling piece 1 and aluminum is used for the cooling piece 1, the shearing heat stress applied to the solder is reduced to reduce the weight of the rectifier.</p> |
