| 摘要 |
A micromodular electronic circuit package is disclosed herein constituting a discrete electronic component of sandwich construction having reduced physical density which, in one form, comprises an insulating panel supporting a pair of spaced-apart metal connectors, the opposite side of which supports an insulative stiffener. The stiffener is provided with a cavity centrally located so as to receive and hold a discrete component unit such as a thin film or chip capacitor, resistor or the like. The chip is provided with connection ends that respectively engage with the pair of metal connectors supported on the insulative panel so that mechanical and electrical interconnection is produced. In another form, the component package includes a heat sink slideably engageable over the electronic package for effecting the dissipation of heat during circuit operation.
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