| 摘要 |
PURPOSE:To produce a through hole of high reliability and to produce a fine pattern with ease, by a method wherein after patterns are formed, allover the surfaces of a board member are chemically plated with nickel, and after patterning is performed, only the required positions of a through hole and the like are electrically plated with copper. CONSTITUTION:After a printed board 3 in which both surfaces of a glass-epoxy board member 1 are coated with copper foils 2 is bored therethrough and then coated with etching resist films, resists 4 for forming a pattern are coated on both surfaces. Subsequently, the copper foils 2 are etched to form patterns 5, and allover the surfaces of the board member 1 are then chemically plated with nickel 6 to electrically connect between the etched patterns. Next, after resists 7 for plating a pattern are formed on the section other than the through hole land and the other required positions, the through hole land and the internal surface of the through hole are electrically plated with copper 8. Thereafter, both the resists 7 for plating a pattern and the chemically plated nickel films laying under the resists 7 are removed, and thereby a printed-wiring board having a through hole 9 whose internal surface is electrically plated with copper is produced. |
