| 摘要 |
PURPOSE:To form a solder mark which can be developed with an alkaline aqueous solution and has the excellent resolution and heat-resisting property by incorporating a polymer binder which is soluble in an alkaline aqueous solution and insoluble in water, a specified oligomer, a photopolymerizable monomer and a sensitizer and/or its precursor in the title composition. CONSTITUTION:The polymer binder which is soluble in the alkaline aqueous solution and insoluble in the water, the oligomer, the photopolymerizable monomer and the sensitizer and/or its precursor capable of forming a free radical by radiating with active rays, are incorporated in the photosensitive resin composition. The oligomer is formed by subjecting a novolak type epoxy resin selected from the group composed of an orthocresol novolak type epoxy resin, a phenol novolak type epoxy resin and a halogenated phenol novolak type epoxy resin, and an unsat. carboxylic acid to an addition reaction in the equivalent ratio of acid group to epoxy group of a range of 0.5-1.05, and then by allowing to react the obtd. unsatd. compd. with a satd. or an unsatd. polybasic acid unhydride. Thus, the solder mask capable of developing with the alkaline aqueous solution and having the excellent resolution and heat-resisting property is obtd. |
