| 摘要 |
<p>The conductor paths pref. consist of synthetic resin filled with nickel powder; and the paths are pref. covered with a layer, 3-5 mu m, thick, of either Ni or Cu. The layer is pref. deposited by electroless- or electroplating. The grain size of the Ni powder used in the conductor paths is pref. 3-5 mu m, whereas the synthetic resin used in these paths is pref. a mixt. of phenolic resin and epoxy resin. Similar conventional printed circuit boards use conductor paths made of silver, but the silver migrates across the substrates to form short circuits between the paths. The invention uses Ni instead of Ag to eliminate such short circuits.</p> |
