| 摘要 |
<p>A semiconductor device comprises a semiconductor wafer arranged between metallic connecting members for supplying electric current to, and leading it from, the wafer, each connecting member having a substantially cylindrical external part. A ring of a sulphone polymer or of polyphenylene sulphide, which may be reinforced with glass fibre material, has portions of its internal peripheral surface surrounding and firmly engaged with the cylindrical parts of the connecting members, the ring and the connecting members forming a protective casing around the semiconductor wafer.</p> |
