发明名称 Selective electroplating
摘要 A method for electroplating a selective area of a part is disclosed comprising the steps of rotating a disc having an absorbent upper surface, maintaining electrolytic solution on the absorbent upper surface of the disc. While such disc is charged anodically and the part is charged cathodically, the part is passed across a chord of the circle within which the disc rotates with the selective area of the part in contact with the electrolytic solution on the rotating disc.
申请公布号 US4220504(A) 申请公布日期 1980.09.02
申请号 US19790031909 申请日期 1979.04.16
申请人 BURTON SILVERPLATING CO. 发明人 HANLEY, WILLIAM H;SCHRADER, CLARENCE O
分类号 C25D5/02;C25D5/06;(IPC1-7):C25D5/06;C25D17/14;C25D17/28 主分类号 C25D5/02
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