| 摘要 |
Apparatus for soldering a plurality of conductors simultaneously to a printed circuit board or suitable connector card and having a controlled pressure-temperature cycle. The apparatus comprises a heater bar mounted on one end of a frame which is vertically pivotable about a support bracket. The support bracket is mounted to a generally flat, rectangular base for receiving a cable to be soldered. The heater bar is formed from metallic bar stock having a rounded contacting end. Two channels are formed along the length of the heater bar: a heating channel holds a resistance heating element, and a cooling channel is connected at one end to a supply of compressed air. The vertical motion and contact pressure of the pivoting frame-heater bar assembly is controlled by a timer which vents compressed air to an air cylinder connected to the frame. The timer also controls the supply of compressed air to the cooling channel of the heater bar, and cycles the resistance heating element on and off in response to a thermostat mounted on top of the heater bar.
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