发明名称 FORMING METHOD OF PATTERN ON METAL SURFACE
摘要 PURPOSE:To form the distinct patterns free from undulations by applying the 1st surface treatment on a metal blank, printing the desired patterns with the specific resist ink and applying the 2nd surface treatment then dissolving away the printed layer. CONSTITUTION:A dissimilar metal covering layer 4 is formed on a metal blank material 3 such as of brass whose surface has been polished by a method such as electroplating or vapor deposition and desired patterns 5 are screen-printed on the surface thereof by using insulation-type resist ink. Thence, a copper plating layer 6 is deposited on the portions other than the patterns by electroplating, after which the blank material is dipped in a sulfide solution, then copper sulfide is formed and the copper plating layer colors. Hence, if the resist printed layer 5 is dissolved away by a thinner or the like, the undercoating layer 4 of the color differing from the color of the copper plating layer appears in correspondence to the pattern, whereby the distinct and smooth patterns 2 as if they are printed are formed. Finally, protecting transparent coating 7 is applied.
申请公布号 JPS55113895(A) 申请公布日期 1980.09.02
申请号 JP19790020363 申请日期 1979.02.22
申请人 NEZAKE DENTO KK 发明人 NEZAKE MASARU
分类号 C25D7/00;B44C1/02;C23C2/00;C23C14/04;C23C14/16;C23C22/68 主分类号 C25D7/00
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