| 摘要 |
PURPOSE:To simplify classified display process by a method wherein a semiconductor element under the condition of multiframes is assembled and is sealed with resin, then its characteristics are examined, and based on the result, a bend, a cut or a hole is provided on lead pieces provided on a frame. CONSTITUTION:Multilead frame 1 is provided. A semiconductor chip is fixed on the tub provided on this. Wire bonding is operated between electrode and lead 4. Next, molding is operated on the chip and a part of the lead by using resin 2. Surrounding lead parts 7 are separated from frame 1. Their ends are bent. Subsequently, the electric characteristics of the chip are measured through the lead. Based on the result, a part of the lead piece of the corner part is bent as shown in 5a-5c, for classified display. By this, re-detection after storage is simplified. |
