发明名称 WORKING METHOD OF SILICON NITRIDE PRODUCT
摘要 PURPOSE:To enhance working rate and yet improve working accuracy by setting the shape through laser working at the working process in obtaining the silicon nitride product. CONSTITUTION:In obtaining the silicon nitride product, the shape is determined through laser working at the working step. According to this method, e.g., machining of microholes or the like which had been difficult with grinding may be readily accomplished and further even with the silicon nitride product, the strength deterioration does not occur. The comparision with conventional methods indicates that, while the rate of working for cutting the silicon nitride product of 4mm thickness is 120mm/min., the rate of working for cutting the product of the same thickness by the conventional method using grinding wheels is 4.8mm/min. This method is highly effective particularly in the case of setting intricate outside shapes or microholes. This is because the machining portion may be made extremely fine through arbitrary throttling of the laser.
申请公布号 JPS55112191(A) 申请公布日期 1980.08.29
申请号 JP19790017916 申请日期 1979.02.20
申请人 发明人
分类号 B28D1/00;B23K26/00;B23K26/40;B28D1/22 主分类号 B28D1/00
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