| 摘要 |
Method for welding fine wires to connecting terminations born by the base of a semiconductor device, using a tool for welding and cutting the wire in the form of a tube (9) which acts by its end face (11) containing the wire (12) to be welded, of which the outer strand (13) is to be welded to the termination (6), an incipient rupture (16) being formed by the inner angle (17) of the tube, and a limited flattening (H) being obtained by contact (40) between part of the end face of the tube and the termination, the value (H) being determined by the choice of an angle (P) created between the termination (6) and the end face (11) of the tube.
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