发明名称 Plate capacitor mfg. process - uses band of dielectric in which pressed capacitor dielectric plates are held by material bridges
摘要 <p>In a method of producing plate capacitors, two metal bonds are unrolled in parallel through a die which stamps the outline of the capacitor plates in the bonds. The bonds are then pased together through a press with a prestamped bond of dielectric paltes (7) being passed between the metal bands at right angle thereto. The sandwich is then passed through an oven and a press before the capacitor sandwiches are pressed from the metal bond. Each dielectric plate is retained in the dielectric bond before being pressed between the metal bands by two material bridges (8). Holes (10) are provided in the dielectric bond for a sprocket drive.</p>
申请公布号 FR2447594(A1) 申请公布日期 1980.08.22
申请号 FR19790001899 申请日期 1979.01.25
申请人 DEGUELDRE ANDRE 发明人
分类号 H01G13/00;(IPC1-7):01G4/18 主分类号 H01G13/00
代理机构 代理人
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