| 摘要 |
<p>PURPOSE:To correct defective products and use them by a method wherein a defective substrate coated with a positive resist is subjected to step-and-repeat by using a corrective reticle larger than a defect, after it is developed, the defect is removed. CONSTITUTION:Required pattern 2 and defective parts 3, 4 exist in the chip pattern region. For correction, first, a corrective reticle larger than the size of the defect is formed. On the other hand, for the defective substrate, a positive resist film is formed to cover pattern 2. Reticles 5, 5' and the defective substrate are fitted to the step-and-repeater. After they are subjected to repeat exposure, they are developed. By this, defects 3, 4 of the substrate are exposed and the remaining part is covered with resist film. Next, by sputtering, the substrate having defects 3, 4 is provided with a film of the same chip pattern as used. After this, the resist film is removed, and the defective parts are filled.</p> |
