发明名称 SPUTTERING TARGET
摘要 PURPOSE:To prevent the contamination of a metallizing coating caused by the thermal breakage of a target, by using two or more sheets of target of the same quality laid one upon another as a nonmetallic sheet target fixed to the cathode of sputtering apparatus. CONSTITUTION:To the cathode body 11 of a sputtering apparatus is fixed by pressing two or more disc targets 17, 18 made of a nonmetallic material such as ceramics, glass, or plastic through the flange 19a of a O-shaped ring 19. Sputtering- metallizing by applying a high frequency power about 7-8W/cm<2> to a terminal 16 while introducing water through pipes 14, 15 to a vacant chamber 12 sometimes breaks the target 17 because of high temp., however scarcely breaks the target 18 because it is not heated to high temp., so that metallizing coating on the surface of a substrate to be metallized is hardly contaminated with impurity ions.
申请公布号 JPS55107775(A) 申请公布日期 1980.08.19
申请号 JP19790013499 申请日期 1979.02.07
申请人 MURATA MANUFACTURING CO 发明人 NISHIYAMA KOUJI;KATOU SUEHIRO;NAKAMURA TAKESHI
分类号 C23C14/00;C23C14/34 主分类号 C23C14/00
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