发明名称 PLANER TYPE HIGH SPEED MAGNETRON SPUTTERING APPARATUS
摘要 PURPOSE:To obtain a uniform distribution of metallizing coating thickness which is not inferior to that obtained by using an annular magnetic pole of a large diameter, by using a magnetic pole, in which a number of small-sized permanent magnet are arranged annularly, in a plasma-focusing magnetic field generation unit installed at the cathode. CONSTITUTION:Use of a magnetic pole made by arranging a number of small permanent magnets 6 annularly on the peripheral part of a circular yoke of convex section gives a plasma-focusing effect which is not inferior to that given when a large annular magnetic pole of the same bore is used, thereby forming metallizing coating of uniform thickness distribution at a low cost and at a high efficiency.
申请公布号 JPS55107776(A) 申请公布日期 1980.08.19
申请号 JP19790014833 申请日期 1979.02.10
申请人 HITACHI LTD 发明人 MIURA YOSHITSUGU
分类号 C23C14/36;C23C14/35;H01J37/34 主分类号 C23C14/36
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