| 摘要 |
This disclosure relates to a housing or enclosure for an electronic component such as a hybrid module to provide RF shielding therefor. The RF shield has a gap separating two parts of the housing or enclosure to provide D.C. isolation between input and output electrical grounds. In one embodiment, the gap is attained by positioning a split metal sheet or layer within dielectric material such as an inner and outer layer of plastic material. Thus, the gap between the split portions of the RF shield is fixed, set or positioned during the formation of the sandwich dielectric-metal-dielectric structure. The gap has a very narrow spacing to obtain optimum RF shielding while still providing D. C. isolation. The dielectric material in the gap between the two split metal portions of the RF shield prevents electrical arcing between the split portions. In another embodiment, a dielectric, gap forming and metal holding (and separating) member is used to separate the two metal portions of the RF shield.
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