| 摘要 |
A circuit package has an inverted receptacle-like housing with a base plate and a depending peripheral wall. Upper and lower substrates are spaced within the housing with the major elements including lead frame elements and thick film conductor circuits on the facing surfaces. The upper substrate, typically containing control circuitry, is mounted along the under side of the base plate while the lower substrate, typically containing power circuitry, closes the receptacle and forms a heat sink for the circuit package. Lead frame extensions within power input and output circuitry project from the lower substrate and protrude through openings within the upper surface of the base plate. In addition, lead frame extensions within the control circuitry on the first substrate likewise protrude through the base plate openings. In certain instances, lead frame extensions from both of the substrates are commonly located in the same opening and operatively provide electrical coupling between the two substrates. In certain instances, terminal plugs are removeably connected to one or more lead frame extensions located within said base plate openings for external electrical connections.
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