发明名称 Method of diffusion bonding duplex sheet cladding to superalloy substrates
摘要 A method of applying a duplex sheet cladding to a structural substrate is disclosed. The method utilizes hot isostatic pressure with molten glass as a pressure transmitting medium. An inner sheet cladding of aluminum is formed over the substrate and then an outer MCrAlY sheet cladding is assembled thereon which completely envelops and seals the inner cladding. Thereafter the duplex cladding is diffusion bonded to the substrate at elevated pressures and temperatures in accordance with a programmed time-temperature hot isostatic pressure cycle.
申请公布号 US4218007(A) 申请公布日期 1980.08.19
申请号 US19790013926 申请日期 1979.02.22
申请人 GENERAL ELECTRIC 发明人 BELTRAN, ADRIAN M;SCHILLING, WILLIAM F
分类号 B23K20/00;B23K20/02;B23K20/14;(IPC1-7):B23K19/00;B23P15/04 主分类号 B23K20/00
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