发明名称 |
Polyurethane solvent-free powder adhesive - used to hot melt bond shoe outsole to bottom |
摘要 |
<p>The adhesive comprises a polyurethane derived from (a) isocyanate component consisting of a major amt. of a diccyclohexyl- or hydrogenated xylylene diisocyanate and (b) sufficient NCO-reactive component to provide a ratio of NCO to NCO reactive gps. of 0.95-1.10:1, pref. 0.975-1.025:1. Component (b) comprises (i) 45-25 mole % of a polyester diol. of mol. wt. is not 750, pref. 1000-2000 and an acid value of 2 and consisting of an ester of adipic acid and 1,4-butane- or 1,6-hexane diol and (ii) 55-75 mole % of 1,4-butane diol chain extender. The adhesive is generally in solvent-free powder form and exhibits good peel and creep strength. The adhesive may also be used to bond garment interlinings and fabrics.</p> |
申请公布号 |
DE2903703(A1) |
申请公布日期 |
1980.08.14 |
申请号 |
DE19792903703 |
申请日期 |
1979.01.31 |
申请人 |
USM CORP. |
发明人 |
THOMAS CARPENTER,AUSTIN;COOK,MICHAEL;HARDY,ALAN |
分类号 |
C08G18/66;C08G18/75;C09J175/06;(IPC1-7):C09J3/16 |
主分类号 |
C08G18/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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