| 摘要 |
PURPOSE:To avoid lowering of the airtightness at the soldered junction part. CONSTITUTION:Piezoelectric oscillator 1 is fixed onto glass substrate 2 via conductive adhesion 9 and then receives the vacuum sealing after putting cover body 3 onto solder layer 8 and then being heated up via hot plate 10 in the vacuum atmosphere or via infrared lamp 11 to fuse layer 8. Cover body 3 is made of the cladding component of Kovar 31 and copper 32 each. Metalized layer 7 provided on substrate 2 is composed of the double metal layer of A and B layers and formed through evaporation. Layer A features high adhesive performance to SiO2, PSG or glass to be able to be soldered, and is the Ni-Cr alloy or the like in the form of the film which is never bitten into the solder nor disappear at the soldering time. While layer B uses effectively the Cu layer which features a high diffusion velocity and high soldering performace to the solder. Furthermore, SiO2 film 6 is provided to secure the electric insulation between electric terminals 4/5 and the cover body. |
