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发明名称
HIGH PACKING DENSITY MULTILAYER CIRCUIT BOARD
摘要
申请公布号
JPS55105398(A)
申请公布日期
1980.08.12
申请号
JP19790013571
申请日期
1979.02.08
申请人
发明人
分类号
H05K3/46;H05K1/02;H05K1/05
主分类号
H05K3/46
代理机构
代理人
主权项
地址
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