发明名称 HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To avoid intersecting wirings and rear surface wirings by using a circuit in which external leads having a plurality of clip shapes are previously coupled, and by forming a required interlead connection. CONSTITUTION:An external lead 8 is coupled with a wiring layer formed on a ceramic base plate 1 and each of the external electrodes 6a-6f in connection to this wiring layer. A hybrid integrated circuit is formed in the condition that certain ones of the external electrodes are coupled. Clips to be coupled with each of the external electrode are formed placed at the identical spacing to the external electrodes coupled with external leads 8 and coupled transversely by a lead frame 9. The external leads are made from a Cu plate, and the electric resistance is reduced by means of plating. The clips are coupled with the external electrodes, and side coupled parts 7 and lead frame 9 are cut with requisite parts left.
申请公布号 JPH01194277(A) 申请公布日期 1989.08.04
申请号 JP19880019426 申请日期 1988.01.28
申请人 NEC CORP 发明人 ISHIHAMA KAZUHARU
分类号 H01R12/04;H05K1/11;H05K3/34 主分类号 H01R12/04
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