发明名称 FORMING METHOD FOR METALLIC FILM
摘要 PURPOSE:To manufacture easily metallic conductor film thinner than conventional films, having a samll thermal strain, which is caused by locally heating, remaining in the substrate, by heating to melt metallic powder adhered to a prescribed, electrified surface region. CONSTITUTION:A soln. 4 of synthetic resin, e.g., vinyl chloride, in a suitable solvent is applied to a region on a substrate 1 where ready-made conductors 2, 3 are to be short-circuited. The applied soln. 4 is dried to form a resin film 5, which is then peeled and removed. The surface 6 of the substrate removed of the resin film 5 is electrified through the movement and separation of electric charge. Metallic powder 7 such as Cr is adhered to the surface 6, and is melted through the scanning of a heat ray, e.g., laser beam 8. As a result, molten powder 7 is welded to the substrate 1, conductor 2, 3 to form a short-circuiting conductor 7'. Excess of the adhered powder 7 is washed away, hereby the conductors 2, 3 are short-circuited by the conductor 7'.
申请公布号 JPS55104463(A) 申请公布日期 1980.08.09
申请号 JP19790012592 申请日期 1979.02.06
申请人 FUJITSU LTD 发明人 NAKAGAWA KENJI;TOYOSHIMA EIJI
分类号 C23C26/00;C23C24/10 主分类号 C23C26/00
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