| 摘要 |
<p>There is disclosed a method and apparatus for continuously soldering the links of chains of precious metals, or links which are plated therewith, whereby solder is applied at the joint of each link. The method is characterized in that the chain is fed down onto a substantially horizontal plane at a speed which is slightly higher than the movement of the place where the link is put down in relation to the horizontal plane, so that the links are pushed somewhat into each other, and in that a small portion of the chain lying on the horizontal plane is heated following the movement of the place of putting the chain down in relation to the horizontal plane, whereby the chain is heated to a temperature at which the solder melts and the soldering of the links takes place without any tension thereof. The apparatus comprises a substantially horizontal plane onto which the chain is fed down, means for heating the chain and the solder to soldering temperature and means for feeding the chain down onto the horizontal plane, whereby the said plane and the means for feeding the chain down are movable at a predetermined relationship to each other.</p> |
