| 摘要 |
PURPOSE:To shape a substrate without damage by making the main face of cutter contact with the edge of semiconductor substrate at an angle of 40 deg. or more and by making the cutter and its mounting part or a part of the substrate holder of elastic substance. CONSTITUTION:The substrate 1 is attached to the holder 3 by vacuumizing and is turned at a fixed speed. The cutter 4 turned at high speed is fed to make itself contact with the substrate by means of the feed mechanism 7. Since the impulsive force applied to the cutter 4 is absorbed and relaxed by the elastic body 5, the impulse applied to the substrate is made extremely less to prevent damage. Also, when the angle alpha made by the main face of the cutter with that of the substrate is 40 deg. or more, the vertical component of the pressing force of the cutter is made less, the substrate can safely be shaped without damage.
|
