发明名称 |
METHOD OF MANUFACTURING A HERMITICALLY SEALED ELECTRONIC COMPONENT |
摘要 |
<p>of the disclosure A method of manufacturing a passive hermetically sealed electronic component having a coupling element of soft alloy material between the component element and the leads for providing strain relief. The component element is composed of a passive element having coated ends composed of a refractory metallic material for providing reliable electrical and mechanical connection to the coupling element.</p> |
申请公布号 |
CA1082900(A) |
申请公布日期 |
1980.08.05 |
申请号 |
CA19780298319 |
申请日期 |
1978.03.02 |
申请人 |
NORTH AMERICAN PHILIPS CORPORATION |
发明人 |
FRANCIS, GAYLORD L.;MORELLI, AMEDEO J. |
分类号 |
H01C1/024;(IPC1-7):01C17/28 |
主分类号 |
H01C1/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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