| 摘要 |
<p>PURPOSE:To increase heat discharge effect by forming the leads which become the semiconductor element connecting unit thicker than other leads and exposing the back sides of these leads on the same plane as the back side of a sealing resin. CONSTITUTION:Semiconductor element 2 is fixed to the surfaces of leads 1a, 1b and 1c, which extend in a plane radially, and a wire connecting its electrode is connected to this. Semiconductor element 2 and the wire connecting unit are sealed by resin 3. At this time, semiconductor element 2 and lead 5, which is to become the wire connecting unit, are made thicker than other leads, and at the same time, the back sides 6 of all leads are exposed on the same plane as the back side of resin 3.</p> |
