发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a wire from coming into contact with a neighboring wire or a stitch by providing a step for a specified stitch at the time of usual resin sealing after bonding. CONSTITUTION:Island 2, a stitch which constitutes the bonding part of external lead 3, and those parts of lead 3, which is to be provided with a step, that are to be pressed by the lead frame of metal mold 5 at the time of resin sealing are partially plated. At this time, partial plating is made over a long extent for the upper surface of lead 3 and over a short extent for the lower surface. When lead frame 1 is pressed by the metal old at the time of resin sealing, the pressed parts of plated lead are deformed upward due to the difference in the plated extent between the upper and the lower surface. Immediately after this, molding is operated by resin sealing. Further, the degree of the step can be adjusted by varying the thickness of plating.
申请公布号 JPS5599756(A) 申请公布日期 1980.07.30
申请号 JP19790007983 申请日期 1979.01.25
申请人 发明人
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
代理机构 代理人
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