| 摘要 |
PURPOSE:To support wafers stably without damaging them in a wafer supporting jig for wafer heat treatment for the production of semiconductor devices by arranging supporting members so that V shape grooves may come to positions to support a wafer by four bisymmetrical points not higher than its center at the highest. CONSTITUTION:Bar shape supporting members 2a, 2b, 2c and 2d on which V shape grooves 1a, 1b ... are formed at prescribed intervals are connected with connecting members 3a, 3b ... arranging and fixing the supporting members so that the V shape grooves may come to positions to support a wafer 4 by four points A, B, C and D which are lower than its center 0 at the highest and are symmetrical with respect to line Y-Y which passes point 0. |
