| 摘要 |
PURPOSE:To operate heat discharge from the back of an IC chip effectively by fixing an IC chip to a substrate having a hollow by means of adhesive and bringing a liquid into contact with the back of the IC chip through the hollow. CONSTITUTION:IC chip 7 is fixed to substrate 1, having hollow 3 with an opening smaller than the external dimensions of the back of IC chip 7, by using adhesive 4. Further, liquid 6 of good heat conducting characteristic, such as water, or Freon, is brought into contact with the back of IC chip 7 through hollow 3.
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