发明名称 WIRE BONDER
摘要 PURPOSE:To prevent relief of wire, by providing a mechanism for bending prolonged wire at tip of connecting tool. CONSTITUTION:At the side of pellet 29 on package 28, supersonic wave oscillation is performed for wire bonding. Secondary, wedge is moved and supersonic oscillation is made at lead 30 side, then wire is cut and fed. At this time, while moving, wire bending lever 14 is worked bending the wire which is extended from wedge 6 and thus relief of wire is prevented.
申请公布号 JPS5599732(A) 申请公布日期 1980.07.30
申请号 JP19790007125 申请日期 1979.01.26
申请人 HITACHI LTD 发明人 UEMATSU SHIYUNEI
分类号 H01L21/60 主分类号 H01L21/60
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