| 发明名称 |
Gold-tin-silicon alloy for brazing silicon to metal |
| 摘要 |
An alloy for brazing a silicon die to a gold-plate kovar header consists essentially of 19 to 21 weight percent tin and 0.6 to 0.8 weight percent silicon with the balance being gold. The alloy melts at a temperature below 200 DEG C. which is substantially lower than that of the conventional gold-silicon eutectic alloy.
|
| 申请公布号 |
US4214904(A) |
申请公布日期 |
1980.07.29 |
| 申请号 |
US19780968873 |
申请日期 |
1978.12.12 |
| 申请人 |
U S OF AMERICA AIR FORCE SECRETARY |
发明人 |
JACOBSON, LOREN A;KITCHEN, DONALD R |
| 分类号 |
B23K35/30;C22C5/02;H01L21/58;H01L23/482;H01L23/492;(IPC1-7):H05K1/04;C22C5/00 |
主分类号 |
B23K35/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
