发明名称 RING SOLDER SHEET
摘要 PURPOSE:To readily insert ring solders onto pins and achieve automatic and faster soldering work by mounting the multiple ring solders to a sheet made of metal such as Al separatably by means of adhesive agents which lose adhesive effect when heated, and in the positions corresponding to the pins such as of card connectors. CONSTITUTION:Multiple ring solders 9 are mounted to a sheet 8 made of metal such as Al, separatably and so as to oppose to the disposition of soldering pins 7. Next, to solder the pins 7 and printed circuit patterns, the ring solder sheet 8 is let off by each specified amount and is let to face over a mother board 5. Next, the through-holes 10 for insertion of pins inserted onto the pins 7 and the ring solders 9 are melted, whereby the pins 7 and mother board 5 are fixed and the metal-made sheet 8 is peeled.
申请公布号 JPS5597896(A) 申请公布日期 1980.07.25
申请号 JP19790005861 申请日期 1979.01.19
申请人 MEIDENSHA ELECTRIC MFG CO LTD 发明人 KUWABARA MITSUO;INOSE YOSHIO
分类号 H05K3/34;B23K35/00;B23K35/02;B23K35/14 主分类号 H05K3/34
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