发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:To obtain stable discharge plasma in a wide control zone for sputtering voltage and current by providing a discharge-stabilizing grid between target and base plate holder. CONSTITUTION:The discharge-stabilizing grid 7 of stainless steel mesh, etc., is provided between the target 1 and the base plate holder 3, and one end of the grid 7 is connected to the chain bar 2. Thus, in such a DC double-pole sputtering apparatus, discharge plasma is stabilized in a wide control zone and therefore better sputtering film can be obtained.
申请公布号 JPS5597471(A) 申请公布日期 1980.07.24
申请号 JP19790005850 申请日期 1979.01.20
申请人 GEN CO LTD 发明人 IMAOKA EIICHIROU;UEMA TSUNEAKI
分类号 C23C14/38;C23C14/34;H01J37/34 主分类号 C23C14/38
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