发明名称 ONE SIDE MOLTEN METAL PLATING EQUIPMENT
摘要 PURPOSE:To obtain uniform thickness of plating layer on one side by a method wherein molten plating metal is elevated to contact the bottom face of steel strip running in the room of non-oxidizing atmosphere to perform plating, the plating thickness is controlled by jetting gas, and then cooled. CONSTITUTION:Steel strip 1 is annealed and activated in reduction furnace A, and is introduced into plating chamber 4 through the slit 3 of barrier plate 2. In the bath 8 of the plating chamber 4, molten plating metal is injected upward from nozzles 11-13 by use of linear motor or electromagnetic pumps 18, 19. The steel strip 1 runs so that the bottom face contacts injected metal and is plated. Non- oxidizing gas is jetted from nozzle 20 and barrier plate 21 covers the plating position so that plating metal 9 is prevented from going over the top surface of the steel strip 1. While the steel strip 1 passes through gas-jet plate thickness control chamber 24 and gas cooling chamber 30, the thickness of plating is uniformly controlled. The steel strip 1 is cooled to a temperature at which no oxidation occurs, and then is discharged.
申请公布号 JPS5597462(A) 申请公布日期 1980.07.24
申请号 JP19790003032 申请日期 1979.01.17
申请人 MITSUBISHI HEAVY IND LTD 发明人 NAKAGAWA YOSHIKIYO
分类号 C23C2/00 主分类号 C23C2/00
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