| 摘要 |
1,086,254. Semi-conductor devices. PHILCOFORD CORPORATION. Feb. 25, 1965 [Feb. 28, 1964], No. 8244/65. Heading H1K. A connection is made to the surface of a semi-conductor body by attaching a fusible wire connector to the surface of the body, enlarging the free end of the wire by thermally fusing the wire and making connection to the enlarged end of the wire. A series of gold wires 30 are joined to the surface 31 of silicon body 29 by thermocompression bonding at "nailheads" 32. When joined initially, the wires 30 are upstanding and each has a blob on the upper end thereof formed by the process of flamecutting the wire from its supply reel after bonding the other end to the body 29. The blobs are brought into contiguity and then melted by a flame to give a single blob 34 which is enlarged and displaced towards the body 29 by the action of the flame. The body 29 which is mounted on a stud 27 is placed within a holder together with stud 26 having thereon solder 59 which solder is brought into contact with gold blob 34 and melted to surround the blob and thus make contact therewith. The device may have up to 10 wires joined in a blob and is said to be suitable for high frequency and large current since the skin effect is minimized by a number of small wires. |
